Knowledge Hub

Resources

White papers, technical articles, and tutorials from Anasim on power delivery for AI silicon.

Power Integrity Hub

Books, papers & patents

Foundational work from over two decades of Anasim power integrity research — books, peer literature, PI-FP simulation studies, and a 40+ patent portfolio.

Books

Power Integrity Analysis and Management for Integrated Circuits — book cover

Power Integrity Analysis and Management for Integrated Circuits

Raj Nair and Donald Bennett

Prentice-Hall PTR Signal Integrity Series, 2010. The first comprehensive treatment of power integrity from chip to system, covering droop theory, continuum simulation, and active noise regulation.

Amazon →
Power Integrity for Nanoscale Integrated Systems — book cover

Power Integrity for Nanoscale Integrated Systems

Masanori Hashimoto and Raj Nair

McGraw Hill, 2014. Advances the field into nanoscale processes covering on-chip resonances, advanced PDN modeling, and power integrity for 3D ICs and TSV assemblies.

Amazon →

Selected Papers & Articles

Emerging Directions for Packaging Technologies

R. Mahajan, Raj Nair et al. — Intel Technology Journal, 2002

Microprocessor Assembly Interconnect Pathfinding Challenges

Raj Nair — Intel Assembly & Test Technology Journal, 2001

Beyond IR Drop: Dynamic Voltage Droops and Total Power Integrity

Raj Nair and Donald Bennett, Anasim Corp. — EETimes, March 2008

IC Floorplanning and Power Integrity

Raj Nair, Anasim Corp. — EDN / SOCcentral, 2008–2010

A Power Integrity Wall Follows the Power Wall

Raj Nair, Anasim Corp. — 2008

PI-FP Simulation Studies

PI Continuum Simulation: Load Modulation

Clock skew splits a load spike into two peaks; true-physical simulation reveals counterintuitive 66% noise increase.

Local Resonances in a Chip Power Grid

Continuum simulation demonstrating frequency-dependent noise amplification of ~20% due to local resonances.

DVD Variation with Load Vector Delays

Load vector phase differences impact DVD by up to 8%. A critique of vectorless analysis limitations.

Patents

40+ US and international patents across power delivery, packaging, IC design, and active noise regulation.

US 7,952,194US 6,878,572US 6,849,909US 6,828,638US 6,812,757US 6,798,265US 6,720,814US 6,717,445US 6,710,440US 6,664,834US 6,646,245US 6,611,448US 6,593,793US 6,580,611US 6,561,820US 6,552,887US 6,538,502US 6,529,398US 6,522,568US 6,466,473US 6,456,133US 6,448,840US 6,420,912US 6,411,151US 6,377,108US 6,366,320US 6,351,191US 6,304,141US 6,271,706US 6,229,357US 6,208,186US 6,084,385US 6,081,105US 5,955,870
White Papers

In-depth technical analysis

Original, rigorous studies of power integrity in modern AI silicon — built on PDNLab simulation.

June 10, 2026

Power Analysis on an AI Accelerator Core with PDNLab

Two-scenario power-integrity analysis of an NVIDIA® H100 SM: lockstep sub-core firing vs. an outer-then-inner spatial slice excitation experiment, showing how workload allocation reshapes on-die dynamic voltage droop.

Read paper PDF available · ~20 min read
Jul 2026

Full-Stack H100 Voltage Droop Analysis in PDNLab™

A complete full-stack PDNLab™ model of the NVIDIA® H100 — board through package to all 144 SM cores — visualizing, pre-silicon, how cumulative voltage droops form and propagate through a multi-core 3D power delivery network under realistic workloads.

Read paper Technical paper
All articles
Jul 2026

Planning the Power Delivery Network of an AI Accelerator

How power planning for a modern GPU or accelerator is actually thought about — from a spatial power map of cores, tensor engines, cache and HBM PHYs, through voltage domains and the impedance budget, to hardening the supply against the coherent di/dt that defines accelerator silicon.

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Jul 2026

From Metal Stack to Model: How Π-FP Abstracts a Modern Power Grid

The full path from an 18-layer copper fabric to a two-layer transmission-line model — the physical hierarchy, the Innovus power-planning flow that builds it, and every Π-FP parameter mapped to a real power-planning knob, with the manual’s own equations.

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Jun 2026

Why a Power Grid Collapses to Two Layers

A real on-chip power distribution network is a dozen-layer mess. To make full-chip dynamic simulation tractable, the power grid is reduced to an equivalent two-layer symmetric transmission-line grid —…

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Jun 2026

Substrate and Interposer

Between the bare silicon die and the printed circuit board sit two layers that rarely get named in a block diagram but determine how a modern chip is powered, connected, and held together: the package…

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Jun 2026

What Enters the Compute Units: The Matrix Math of an LLM

A large language model's computation reduces almost entirely to matrix multiplication, and a frontier accelerator's compute units do one thing: multiply tiles of two matrices and accumulate the result…

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Jun 2026

What Is a Systolic Array?

A systolic array is a grid of identical processing elements through which data is pumped one step per clock cycle, with each element performing a single multiply-accumulate as the data passes.

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Jun 2026

Simultaneous Switching in AI Compute: The Systolic Array and the Global Power Grid

The systolic array is the dominant compute structure in AI silicon because it maximizes arithmetic per unit of memory traffic.

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GEMMGEMV
Jun 2026

The Two Jobs of the Model: Prefill and Decode

A large language model serving a request is not running one computation. It is running two — and they could hardly be more different. The first reads the prompt; the second writes the answer.

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Jun 2026

Why AI Cores Need to Be Modeled with PDNLab

An AI core has no single droop. Its droop surface is the convolution of the physical power grid with a specific workload's spatiotemporal current, and it changes with every workload the core executes.…

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Jun 2026

Modeling with PDNLab: Tunable Parameters and Design Decisions

What you can actually tune in a power-grid model — wire width, pitch, sheet resistance, inductance, and capacitance — what each one physically does, and why damping turns the grid into an R–L–C system rather than a resistor.

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Jun 2026

Why the On-Chip Power Grid Behaves as an Electromagnetic Surface

At modern switching speeds the grid stops acting like wiring and becomes a continuous electromagnetic medium — storing energy in fields, carrying disturbances as waves, and coupling every conductor to its neighbors. A first-principles explanation.

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Jun 2026

A Short History of On-Chip Power Grids

From single aluminum traces to upper-metal meshes, flip-chip feed, on-die decap, and backside power delivery — how on-chip power distribution became one of the hardest problems on the die.

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Jun 2026

The Power Integrity Wall: What Anasim Predicted in 2008

A recap of Raj Nair’s 2008 EE Times argument — behind the Power Wall sits a Power Integrity Wall, with inductive L·di/dt noise doubling every process generation. The Roots-of-Two derivation, and why AI silicon walked into it.

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35 MHz
Jun 2026

Paper Review: LLM Workload Reliability, di/dt Effects, and Voltage Droops

A walkthrough of Jiang et al. (HPCA 2026, UT Austin & AMD): how LLM inference excites GPU PDN resonance, their ladder RLC model, and the result where a 10 W swing at resonance beats a 100 W swing off it.

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Jun 2026

Capacitors Inside a Chip

Every chip is full of capacitors — the local charge reservoir that holds the supply voltage up the instant millions of transistors switch. What on-die capacitance is, the types, and how it delivers charge.

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Jun 2026

The PDN Architect

Inside a modern chip program — the team, the lifecycle, and the experienced power-delivery engineer who dictates how current reaches every transistor and asks the questions that keep a superchip’s power alive.

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Jun 2026

What EDA Power-Integrity Tools Actually Do

Power integrity is a pipeline, not one tool — and each EDA tool owns one stage. A breakdown vendor by vendor: RTL power, extraction, on-die IR, package PDN impedance, SPICE, electrothermal — and where the methodology stops.

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Jun 2026

2.5D and 3D Chip Integration, Explained

A direct breakdown of modern advanced packaging — CoWoS, EMIB, InFO, TSVs, microbumps, hybrid bonding, Foveros, SoIC, HBM, and UCIe. What each is, how it connects dies, and who uses it.

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Jun 2026

Wire Bonding vs Flip-Chip: Face-Up, Face-Down, and the C4 Bump

How a die connects to its package, and the key to keeping it straight: which way the active face points. A diagram-led explanation of face-up vs face-down, the C4 bump, and why the chip got flipped over.

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Jun 2026

Powering the Largest Chip Ever Built: The Cerebras Wafer-Scale Engine

~25 kW into one 21.5 cm silicon square — about 25,000 A at 1 V. Why edge delivery is impossible at wafer scale, how power is fed vertically across the whole wafer, the CTE-mismatch connector, and why it forces the continuum view of PI.

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Jun 2026

Why Memory Is the Bottleneck for AI Chips

For modern AI chips the limiter is rarely compute — it's memory. Why moving data sets the pace: bandwidth vs capacity, bandwidth-bound decode, the KV cache, the SRAM scaling cliff, HBM and DRAM — and why it's an energy problem.

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Tutorials

Learn power integrity, step by step

In development
Course 10 Lessons Beginner → Advanced

Power Integrity and Management for AI Silicon

A progressive ten-lesson journey through the physics and engineering of on-chip power delivery — from IR-drop fundamentals through rogue-wave phenomena to sign-off methodology. Everything an engineer needs to understand why modern chips fail and how to prevent it.

I Foundations
II Dynamic Physics
III Scaling
IV Design & Verification
Coming Soon
droop

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